Product Profile of Compact Plasma Cleaning System

Compact Plasma Cleaning System is suitable for in line operation. The Plasma Cleaning System is ideal for oxide removal on copper lead frames prior to wire bonding. The Plasma Cleaning System is apt for organic decontamination prior to wire bonding and adhesion promoter prior to moulding. Plasma Cleaning System is available in a dimension of 500mm X 1350mm X 1800mm [H] and in a weight range of 400kgs.Plasma Cleaning System operates on a power supply rate of 100V to 240 V, in single phase mode of operation, at a frequency rate of 50 Hz or 60Hz. Plasma Cleaning System can be availed in maximum lead frame dimension of 280mm X 80mm X 1mm [H] and in a minimum lead dimension of 130mm X 25mm X 0.1mm [H]. Plasma Cleaning System is also used for general activation, cleaning and decontamination. Compact Plasma Cleaning System helps in flux removal from semiconductor packages or hybrids.

Key specifications of Compact Plasma Cleaning System:

• Available in a dimension of 500mm X 1350mm X 1800mm [H] and in a weight range of 400kgs

• Operates on a power supply rate of 100V to 240 V, in single phase mode of operation, at a frequency rate of 50 Hz or 60Hz

• Can be availed in maximum lead frame dimension of 280mm X 80mm X 1mm [H] and in a minimum lead dimension of 130mm X 25mm X 0.1mm [H]


Applications of Compact Plasma Cleaning System:

• Suitable for in line operation

• Oxide removal on copper lead frames prior to wire bonding

• Organic decontamination prior to wire bonding

• Adhesion promoter prior to moulding

• Adhesion promoter of die attach materials on lead frames or PBGA strips

• Flux removal from semiconductor packages or hybrids

• Adhesion promoter for flip chip packages prior to underfill

• General activation, cleaning and decontamination